| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition, restraining the hygroscopic property, and improving thermal cycle resistance without impairing anti-migration characteristics when used in a printed wiring board in its cured material. <P>SOLUTION: The photocurable resin composition comprises carboxyl group-containing resin, a photoinitiator, styryl group-containing compound and a maleimide compound. <P>COPYRIGHT: (C)2011,JPO&INPIT |
