| 摘要 |
PURPOSE: A method of manufacturing a semiconductor device is provided to prevent oxidation of copper which is generated in the edge of a wafer by discharging a reducer including hydrogen to the front of a wafer. CONSTITUTION: A wafer(100) comprises a front side(100a) and a back side(100b) which face with each other. A wafer is arranged on a wafer chuck(1). A fixing pin(p) is arranged on the wafer chuck and fixes the wafer. A rotary shaft(2) rotates the wafer chuck including the wafer at predetermined speed. A nozzle(3) comprises a hole discharging air, gas, powder, and liquid to the front side of the wafer.
|
