Composite circuit board with metallic base plate - obtd. by fixing a thick layer conductor plate on a metallic base plate using a pressure hardenable silicone adhesive hardened in separate oven process

摘要

Composite circuit board arrangement consists of a metallic baseplate (1) on which is a thick film circuit board (2), consisting of a ceramic substrate (21) with conductor tracks (22,23) connected by units (4,5) to components (3) mounted on the board. A pressure-hardened adhesive (6) is applied at spaced positions on the baseplate, with a silicone adhesive (7) in the intervening spaces. The circuit board is bonded to the baseplate by the adhesive. ADVANTAGE - Strong bond, immediately usable after bonding.