CIRCUIT BOARD, MULTI-LAYER WIRING BOARD, METHOD FOR MAKING CIRCUIT BOARD, AND METHOD FOR MAKING MULTI-LAYER WIRING BOARD,申请号KR20057009164-传众专利搜索

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发明名称	CIRCUIT BOARD, MULTI-LAYER WIRING BOARD, METHOD FOR MAKING CIRCUIT BOARD, AND METHOD FOR MAKING MULTI-LAYER WIRING BOARD
摘要
申请公布号	KR101012239(B1)	申请公布日期	2011.02.08
申请号	KR20057009164	申请日期	2003.11.19
申请人		发明人
分类号	H05K3/46;H05K1/00;H05K3/34;H05K3/38	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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