发明名称 PLASMA PROCESSING APPARATUS, METHOD FOR USING PLASMA PROCESSING APPARATUS, AND METHOD FOR CLEANING PLASMA PROCESSING APPARATUS
摘要 <p>A plasma processing apparatus (101) is provided with: a chamber, which includes side walls (12) surrounding the outer circumference of the chamber, and a top plate (11) covering the upper side of the chamber; a stage (14) for disposing a subject to be processed (13) in the chamber; and a plurality of main electrodes (15) arranged at the center of the top plate (11) such that the main electrodes protrude downward from the top plate (11) and face the subject (13); and a cleaning electrode (31), which is, when viewed from the top, disposed outside of the region wherein the main electrodes (15) are arranged and is not supplied with power at the time of plasma-processing the subject (13), and is supplied with power at the time of cleaning the inner surface of the chamber.</p>
申请公布号 WO2011013458(A1) 申请公布日期 2011.02.03
申请号 WO2010JP60197 申请日期 2010.06.16
申请人 SHARP KABUSHIKI KAISHA;NISSIN ELECTRIC CO., LTD.;NAKANISHI, KENJI;HOSHINO, ATSUYUKI;MORIGUCHI, MASAO;TAKAHASHI, EIJI 发明人 NAKANISHI, KENJI;HOSHINO, ATSUYUKI;MORIGUCHI, MASAO;TAKAHASHI, EIJI
分类号 C23C16/44;C23C16/50;H01L21/3065;H05H1/46 主分类号 C23C16/44
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