发明名称 DIE HEATING/COOLING STRUCTURE AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To efficiently heat/cool a die in a die heating/cooling structure in which an induction heating heater for heating the die is inserted in the die, and a cooling water passage for cooling the die is formed in the die. SOLUTION: Heater insertion holes 23, 24 for inserting the induction heating heater 20 are provided in the die 13 to form cooling water passages 34, 35 between the inner peripheries of the heater insertion holes 23, 24 and the outer periphery of the induction heating heater 20. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011020390(A) 申请公布日期 2011.02.03
申请号 JP20090168447 申请日期 2009.07.17
申请人 HONDA LOCK MFG CO LTD;SHIMADA PHYS & CHEM IND CO LTD 发明人 NODA YUICHIRO;ISHIMA TSUTOMU
分类号 B29C33/02;B29C45/73 主分类号 B29C33/02
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