| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic control unit which uses a heat releasing gel and has high heat dissipation. SOLUTION: A semiconductor device 31 that is installed to a circuit board 20 includes a semiconductor chip, leads which electrically connect the semiconductor chip and substrate to each other, and a resin body which molds the semiconductor chip. A case 50 receives the semiconductor device 31. The heat releasing gel 60 contacts the semiconductor device 31, and conducts heat generated from the semiconductor device 31 to a first cover 51 located on one side of the semiconductor device 31, which is opposite from the circuit board 20. A groove portion 54 is placed at a location between the circuit board 20 and the first cover 51. Therefore, movement of the heat releasing gel 60 is limited, and heat can be released to a side of the case through the heat releasing gel 60 with high efficiency. COPYRIGHT: (C)2011,JPO&INPIT |
