发明名称 PEELABLE POLYIMIDE FILM LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a peelable polyimide film laminate which is obtained by laminating films having high heat resistance and a low linear expansion coefficient, wherein a film as reinforcing material in the laminate easily peeled as necessary. SOLUTION: The peelable polyimide film laminate is obtained by laminating a polyimide film obtained by reacting aromatic tetracarboxylic acids with aromatic diamines having benzoxazole skeleton and a polyimide film obtained by reacting aromatic tetracarboxylic acids with aromatic diamines without allowing an adhesive layer to intervene between the films, wherein an initial peeling strength between the films constituting the laminate is in the range of 0.02 to 2.0 N/cm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011020399(A) 申请公布日期 2011.02.03
申请号 JP20090168719 申请日期 2009.07.17
申请人 TOYOBO CO LTD 发明人 YOSHIDA TAKESHI;KAWAHARA KEIZO;TSUTSUMI MASAYUKI
分类号 B32B27/34;C08G73/10 主分类号 B32B27/34
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