| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure reducing heat resistance between an IC (Integrated Circuit) chip and a heat radiation pattern so as to increase the heat radiation effect regardless of no conductor connection between an electrode of the IC chip and the heat radiation pattern. <P>SOLUTION: A conductive pattern formed on a principal plane of a wiring board includes a lead-out wiring pattern and the heat radiation pattern 15. The lead-out wiring pattern is connected with an electrode connected with an external device of the IC chip 11 or an electrode unconnected with the external device via a conductor. The heat radiation pattern 15 is physically separated from both of the IC chip 11 and the pattern, and has a surface area larger than that of the lead-out wiring pattern. Mutually opposing parts of the wiring pattern and the heat radiation pattern 15 have uneven forms and disposed such that the uneven forms are engaged with each other via a gap 16. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
