发明名称 CIRCUIT PROTECTION ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a circuit protection element capable of making it melt even in case of flowing of low electric current. SOLUTION: The circuit protection element includes a pair of upper surface electrodes 12 fitted at either end part of an insulation substrate 11, an element part 13 bridging the pair of upper surface electrodes 12, a base layer 14 between the element part 13 and the insulation substrate 11, and an end surface electrode 16a connected with the upper surface of the element part 13. The element part 13 is formed by sputtering, and is structured of three layers which are a first element part 17, a second element part 18 and a third element part 19 from the insulation substrate 11 side in this order. The first element part 17 is structured of a material with excellent adhesion with the insulation substrate 11, the second element part 18 is structured of aluminum or an alloy with aluminum and copper, and the third element part 19 is structured of nickel or an alloy with nickel and copper. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011023213(A) 申请公布日期 2011.02.03
申请号 JP20090167407 申请日期 2009.07.16
申请人 PANASONIC CORP 发明人 KITAMURA TAKASHI;WASHISAKI TOMOYUKI;TODA MASUMI;IWAO TOSHIYUKI;MATSUMURA KAZUTOSHI
分类号 H01H85/048;H01H69/02;H01H85/046;H01H85/06;H01H85/10;H01H85/17 主分类号 H01H85/048
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