发明名称 |
METHOD FOR MANUFACTURING ELECTROCONDUCTIVE MATERIAL-FILLED THROUGHHOLE SUBSTRATE |
摘要 |
Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
|
申请公布号 |
US2011023298(A1) |
申请公布日期 |
2011.02.03 |
申请号 |
US20100903319 |
申请日期 |
2010.10.13 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
CHUJO SHIGEKI;NAKAYAMA KOICHI |
分类号 |
H05K3/42;H05K3/16 |
主分类号 |
H05K3/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|