发明名称 |
CHIP COMPRISING CONDUCTIVE POLYMER BUMP AND ITS FABRICATION METHOD AND ELECTRONIC APPLICATION HAVING THE SAME AND ITS FABRICATION METHOD |
摘要 |
<p>PURPOSE: A chip, a manufacturing method thereof, and an electronic part thereof are provided to prevent an electrical short-circuit by attaching a chip having a conductive polymer bump to a substrate. CONSTITUTION: A first metal layer is coated onto the surface of a plurality of holes and a photosensitive layer. A core polymer(240) is formed by solidifying a liquid polymer. A second metal layer is coated onto the surface of the core polymer and the first metal layer. A plurality of conductive polymer bumps, which are electrically insulated on the upper side of a wafer, are formed. A plurality of conductive polymers are projected to the upper side of the wafer. A chip having the conductive polymer bump is manufactured by cutting the wafer along a cutting line.</p> |
申请公布号 |
KR20110010402(A) |
申请公布日期 |
2011.02.01 |
申请号 |
KR20090067953 |
申请日期 |
2009.07.24 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
YOO, CHOONG DON;KIM, SUN RAK;PARK, AH YOUNG |
分类号 |
H01L21/60;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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