| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to easily discharge heat in a flip chip and a semiconductor die by forming a lead on the upper side of a flip chip. CONSTITUTION: A circuit board is comprised of a first insulation(111), a first wiring pattern(112) formed on the first insulation layer, a second wiring pattern(114) formed on the opposite side to the first wiring pattern on the insulation layer, and a conductive via(116) which electrically connects the first wiring pattern with the second wiring pattern. A semiconductor die(120) with a plurality of bond pads(121) are received on the circuit board. The first wiring pattern and the bond pad of the semiconductor die are electrically connected through the bonding of a conductive wire(130). A film is formed on the upper side of the semiconductor die. The semiconductor die, the conductive wire, the first insulation layer and the side of the film are covered with an encapsulant. The upper side of the film is encapsulated and removed to be exposed to the outside. A flip chip(150) is transferred and received on the upper side of the semiconductor die. A solder ball(160) is fused on the second wiring pattern of the circuit board.</p> |
