| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the conventional method of manufacturing electronic equipment, wherein it is difficult to improve the reliability of the electronic equipment.SOLUTION: This method of manufacturing electronic equipment includes processes of: bonding a mother board 81 to a mother board 83 opposite to the mother board 81 through an element layer 53 through a sealing material 17 and a second sealing material 99; forming a groove 111 by etching a gap region 93 from the mother board 83 toward the mother board 81 with the sealing material 17 and the second sealing material 99 as masks after the bonding process; thinning the thickness of the mother board 81 from the other surface 81a of the mother board 81 at least up to the groove 111 after the groove forming process; and forming a protective coat 101 using a material having resistance to the above etching in a region 97 to be protected on the first surface 52a of the mother board 81 before the bonding process. |
