THIN-FILM FLIP-CHIP SERIES CONNECTED LEDS

摘要

A light-emitting diode (LED) is fabricated by forming the LED segments (100-1,100-2) with bond pads (114,116) covering greater than 85% of a mounting surface of the LED segments and isolation trenches (118) that electrically isolate the LED segments (100-1,100-2), mounting the LED segments on a submount (120) with a bond pad (124) that couples two or more bond pads (114,116) from the LED segments, and applying a laser lift-off to remove the growth substrate (102) from the LED layer.