发明名称 HEAT-SENSITIVE ADHESIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive material that exhibits high adhesive force to an adherend with a coarse surface, such as a corrugated cardboard, or the like, and does not damage matching properties such as a printer travelling property.SOLUTION: The heat-sensitive adhesive material comprises a support and, provided with on one surface thereof, a heat-sensitive adhesive layer that exhibits adhesive properties by heating, where the heat-sensitive adhesive layer exhibits, after the manifestation of the adhesive properties, an adhesive force of at least 15 N/50 mm (7.5 N/inch) and at most 40 N/50 mm (20 N/inch) in a temperature environment of 5°C or higher and 9°C or lower, where the contact angle of water to the heat-sensitive adhesive layer in a non-adhesive state at 20°C is at least 105° and at most 125°.
申请公布号 JP2011016857(A) 申请公布日期 2011.01.27
申请号 JP20090160411 申请日期 2009.07.07
申请人 RICOH CO LTD 发明人 KUGO TOMOYUKI;SHINPO HITOSHI;YAMAGUCHI TAKEHITO
分类号 C09J7/02;B32B27/00;C09J5/06;C09J129/04;C09J201/00;G09F3/10 主分类号 C09J7/02
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