A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.
申请公布号
US2011017407(A1)
申请公布日期
2011.01.27
申请号
US20100842112
申请日期
2010.07.23
申请人
HSU CHEN-KE;CHI LIANG-SHENG;CHEN CHUN-CHANG;SU WIN-JIM;LIN HSU-CHENG;TSAI MEI-LING;LIU YI LUNG;OU CHEN
发明人
HSU CHEN-KE;CHI LIANG-SHENG;CHEN CHUN-CHANG;SU WIN-JIM;LIN HSU-CHENG;TSAI MEI-LING;LIU YI LUNG;OU CHEN