发明名称 RADIATION-SENSITIVE RESIN COMPOSITION, RADIATION-SENSITIVE COVER LAY AND FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide: a radiation-sensitive resin composition having high resolution and giving a film having excellent flexibility and flame retardancy; a radiation-sensitive cover lay obtained from the radiation-sensitive resin composition; and a flexible printed wiring board with a protective film obtained from the radiation-sensitive cover lay.SOLUTION: The radiation-sensitive resin composition includes: (A) a novolac type epoxy acrylate resin; (B) a bisphenol type epoxy acrylate resin; (C) a polyfunctional (meth)acrylate compound of hexa- or higher functionality not having a hydroxyl group but having a phosphazene structure; and (D) a photopolymerization initiator.
申请公布号 JP2011017804(A) 申请公布日期 2011.01.27
申请号 JP20090161320 申请日期 2009.07.08
申请人 JSR CORP 发明人 NISHIOKA TAKASHI;MORI TAKASHI;GOTO HIROFUMI
分类号 G03F7/027;C08F290/00;C08G59/17;G03F7/004;H05K1/03;H05K3/28 主分类号 G03F7/027
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