发明名称 |
RADIATION-SENSITIVE RESIN COMPOSITION, RADIATION-SENSITIVE COVER LAY AND FLEXIBLE PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide: a radiation-sensitive resin composition having high resolution and giving a film having excellent flexibility and flame retardancy; a radiation-sensitive cover lay obtained from the radiation-sensitive resin composition; and a flexible printed wiring board with a protective film obtained from the radiation-sensitive cover lay.SOLUTION: The radiation-sensitive resin composition includes: (A) a novolac type epoxy acrylate resin; (B) a bisphenol type epoxy acrylate resin; (C) a polyfunctional (meth)acrylate compound of hexa- or higher functionality not having a hydroxyl group but having a phosphazene structure; and (D) a photopolymerization initiator. |
申请公布号 |
JP2011017804(A) |
申请公布日期 |
2011.01.27 |
申请号 |
JP20090161320 |
申请日期 |
2009.07.08 |
申请人 |
JSR CORP |
发明人 |
NISHIOKA TAKASHI;MORI TAKASHI;GOTO HIROFUMI |
分类号 |
G03F7/027;C08F290/00;C08G59/17;G03F7/004;H05K1/03;H05K3/28 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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