发明名称 |
THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITIONS AND RELATED APPLICATIONS |
摘要 |
<p>Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.</p> |
申请公布号 |
WO2011010290(A1) |
申请公布日期 |
2011.01.27 |
申请号 |
WO2010IB53331 |
申请日期 |
2010.07.21 |
申请人 |
TICONA LLC;SAGA, YUJI;UNE, NARUMI |
发明人 |
SAGA, YUJI;UNE, NARUMI |
分类号 |
C08K3/00;C08K7/04;C09K19/02;H05K5/00 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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