| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be simply manufactured and highly suppresses an occurrence of cracks in a circuit element region, and to provide a semiconductor chip which can be obtained by using this and highly suppresses an occurrence of cracks in the circuit element region.SOLUTION: The semiconductor device includes: a semiconductor substrate 11; and a plurality of circuit elements provided on the surface 11a of the semiconductor substrate 11. The surface 11a of the semiconductor substrate 11 has: a plurality of circuit element regions 12 to which circuit elements are provided; and scribing lines 13 surrounding the circuit element regions 12. A plurality of through-holes 14 are bored within the scribing lines 13 along the circuit element regions 12 of a semiconductor device 1. The semiconductor chip is obtained by dividing the semiconductor device 1 within the scribing line 13. |
