| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board. |
