发明名称 METHOD AND SYSTEM FOR PACKAGING MEMS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a MEMS-based display device.SOLUTION: The MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate attached to a back plate via a seal and the back plate can contain electronic circuitry for controlling the array of interferometric modulators. The back plate can be a physical support for device components (for example, electronic components etc.) which can be used to control the state of the display. The back plate can also be utilized as a primary structural support for the device.
申请公布号 JP2011018054(A) 申请公布日期 2011.01.27
申请号 JP20100178015 申请日期 2010.08.06
申请人 QUALCOMM MEMS TECHNOLOGIES INC 发明人 MILES MARK W;SAMPSELL JEFFREY B;PALMATEER LAUREN;ARBUCKLE BRIAN W;FLOYD PHILIP D
分类号 G02B26/02;B81B3/00;B81B7/02;B81C3/00 主分类号 G02B26/02
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