MULTIPLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To prevent a multiple printed circuit board comprising front layers laminated on both surfaces of a core layer from warping cased by difference in solder resist areas between both front layers without separately providing a wire on both front layers.SOLUTION: A dummy wire 25 electrically insulated from a circuit of a printed circuit board and having a thermal expansion coefficient larger than that of resin constituting the core layer 11 and the front layers 12 and 13 is provided only on the front layer 12 with a smaller area of solder resist 24 of the front layers 12 and 13 provided on both surfaces of the core layer 11.