发明名称 CIRCUIT DESIGN METHOD FOR MULTI-LAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board design method capable of arranging a specified wiring pattern in a surface layer by a simple means without changing the program of a central processing unit. SOLUTION: Component data required for a circuit are registered in a step S.11, the data of a surface layer wiring pattern are inputted as virtual components in a step S.12, the data of a multi-layer printed board are inputted in a step S.13 and the data of a circuit diagram are inputted in a step S.14. In a step S.15, based on information inputted in the four steps, the arrangement of components and the wiring pattern is automatically designed in the central processing unit 13b. The surface layer wiring pattern is surely arranged in the surface layer since it is handled similarly to the components. A part to be corrected is pointed out in a step S.17 until a designed result is satisfying, and the processing of the step S.15 is repeatedly executed.
申请公布号 JP2000181947(A) 申请公布日期 2000.06.30
申请号 JP19980357482 申请日期 1998.12.16
申请人 OKI ELECTRIC IND CO LTD 发明人 OKAWA SHIGENOBU
分类号 H05K3/00;G06F17/50;(IPC1-7):G06F17/50 主分类号 H05K3/00
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