| 摘要 |
This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50° C. or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodiments include a bundled wafer lamination film, a semiconductor wafer with a multilayer adhesive film attached, a process for attaching a semiconductor die to a substrate, and a method of preventing individually diced dies from sticking to one another.
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