发明名称 OPTICAL FIBER PACKAGING SUBSTRATE, PRODUCTION OF THE OPTICAL FIBER SUBSTRATE AND MOLD FOR PRODUCING OPTICAL PACKAGING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To easily form a groove into which an optical fiber is fixed and to improve the durability and reliability of an optical fiber packaging substrate. SOLUTION: The optical fiber packaging substrate has a substrate 1 on which an optical element is packaged and an optical fiber fixing part 2 to which the optical fiber for transmitting the light signal inputted and outputted to and from the optical element is fixed. The optical fiber fixing part 2 is so disposed as to enclose the circumference of the substrate 1 and is formed with the groove 21 to be fixed with the optical fiber on the surface of the optical fiber fixing part 2. The optical fiber packaging substrate constituted in such a manner is produced by a process stage for closing the molds 31 and 32 provided with projecting parts for forming the groove 21 on the surface of the optical fiber fixing part 2 on the cavity surfaces in the state of putting the substrate 1 therebetween and a stage for injecting a resin into the cavities of the molds 31 and 32 and curing this resin.
申请公布号 JP2000356728(A) 申请公布日期 2000.12.26
申请号 JP19990169900 申请日期 1999.06.16
申请人 NEC CORP 发明人 ODA MIKIO;HOJO SAKAE;SHIMADA YUZO
分类号 G02B6/42;G02B6/00;(IPC1-7):G02B6/42 主分类号 G02B6/42
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