| 摘要 |
A mounting structure is provided in which outer electrodes of an electronic component are soldered on lands provided on a circuit board. Two of the lands on which two of the outer electrodes disposed along a diagonal of a principal surface of the electronic component are soldered, are configured such that inner vertexes defined at opposite ends of a minimum distance between the lands are aligned with inner vertexes defined at opposite ends of a minimum distance between the outer electrodes. That is, sides of the outer electrodes are aligned with outer edges of the lands. Accordingly, only one positional relationship is permitted between the electronic component and the mounting surface, the positional relationship causing a total area of the outer electrodes facing the lands to be maximized. |
