| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively manufacture a metal core substrate having an intermediate layer including a core requiring high conductivity and a terminal requiring high hardness.SOLUTION: A metal plate 11 is manufactured using a metal plate such as oxygen-free copper or tough pitch copper where conductivity (IACS%) is ≥95%. Protrusion terminals 12 disposed on right and left of the metal plate 11 are manufactured using metal plates such as brass having hardness higher than that of the oxygen-free copper or tough-pitch copper while having conductivity (IACS%) in degrees of 30-80%. The two metal plates 11 and protrusion terminals 12 manufactured on the wiring board 10 are positioned in a relatively positional relation on the wiring board 10, a prepreg (resin layer) 31 having metal foil is superimposed on one or both surfaces of a metal plate 25 over the two metal plates 11 and the protruding terminals 12 of the wiring board 10, and then pressurized and heat-treated for lamination. |
