发明名称 |
METHOD FOR FORMING PHOTORESIST-LAMINATED SUBSTRATE USING AEROSOL OF METAL NANOPARTICLE, METHOD FOR PLATING INSULATING SUBSTRATE, METHOD FOR SURFACE TREATING METAL LAYER OF CIRCUIT BOARD, AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a photoresist-laminated substrate that is widely applicable as an environment-friendly manufacturing method by using metal particles in an aerosol condition unlike a conventional wet manufacturing method.SOLUTION: The method for forming a photoresist-laminated substrate includes steps of: preparing a laminated substrate including an insulating substrate 310 and a metal layer 330; coating the metal layer 330 with an aerosol 350 of metal nanoparticles; laminating a photoresist film 370 on the metal layer coated with the aerosol of metal nanoparticles. |
申请公布号 |
JP2011014916(A) |
申请公布日期 |
2011.01.20 |
申请号 |
JP20100182261 |
申请日期 |
2010.08.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHOI HEE SUNG;KIM BAE KYUN;KIM MI-YANG;LEE SEOUNG JAE |
分类号 |
H05K3/18;H01G4/12;H01G4/30;H05K3/24;H05K3/38 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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