发明名称 METHOD FOR FORMING PHOTORESIST-LAMINATED SUBSTRATE USING AEROSOL OF METAL NANOPARTICLE, METHOD FOR PLATING INSULATING SUBSTRATE, METHOD FOR SURFACE TREATING METAL LAYER OF CIRCUIT BOARD, AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a photoresist-laminated substrate that is widely applicable as an environment-friendly manufacturing method by using metal particles in an aerosol condition unlike a conventional wet manufacturing method.SOLUTION: The method for forming a photoresist-laminated substrate includes steps of: preparing a laminated substrate including an insulating substrate 310 and a metal layer 330; coating the metal layer 330 with an aerosol 350 of metal nanoparticles; laminating a photoresist film 370 on the metal layer coated with the aerosol of metal nanoparticles.
申请公布号 JP2011014916(A) 申请公布日期 2011.01.20
申请号 JP20100182261 申请日期 2010.08.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHOI HEE SUNG;KIM BAE KYUN;KIM MI-YANG;LEE SEOUNG JAE
分类号 H05K3/18;H01G4/12;H01G4/30;H05K3/24;H05K3/38 主分类号 H05K3/18
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