发明名称 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for processing a substrate for removing photoresist on the substrate.SOLUTION: The method for processing a substrate includes steps of: arranging a substrate formed with a photoresist film; providing a processing liquid for removing the photoresist film onto the substrate; and providing mist on the substrate to contact the processing liquid. Since the mist reacts with the processing liquid to additionally form a hydroxide radical and, since the mist and the processing liquid perform heat generation reaction, the efficiency in removal of the photoresist can be improved.
申请公布号 JP2011014906(A) 申请公布日期 2011.01.20
申请号 JP20100143521 申请日期 2010.06.24
申请人 SEMES CO LTD 发明人 RHO EUN-SU;BAE JEONG-YONG
分类号 H01L21/027;H01L21/304 主分类号 H01L21/027
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