| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer interconnection board capable of receiving signals without being affected by reflection signals to be generated because of having a stub, and to provide a method of manufacturing the multilayer interconnection board.SOLUTION: The multilayer interconnection board includes a laminated sheet 1 including a signal layer 2 formed inside and a ground layer 3b differing from the signal layer 2. Further, the laminated sheet 1 includes a through hole 4 passing through the laminated sheet 1 and including a surface covered with a conductor. Also, a resistive element 7, which connects an opening end of the through hole 4 to the ground layer 3b, and a receiver 8, which is formed on a first surface of the laminated sheet 1 and receives a signal via the signal layer 2 and the through hole 4, are provided on the laminated sheet 1. |
