| 摘要 |
<p>An exposure apparatus and method for detecting a leveling of wafer are provided to perform an exact leveling measurement procedure by moving the level sensor spot array to the center of wafer. The exposure apparatus comprises the light source, the lens array, the projection grating(12), the projection optical section, the wafer stage and the detection optical section. The level sensor spot array(20) is located in the projection grating. The level sensor spot array comprises nine spots whose shape is rectangular. The rectangular spots have the length of 1.0~1.4mm and the width of 1.2~1.6mm. The rectangular spots have pitch of 1.0~2.0mm. The optimum pitch of the rectangular spot is 1.5mm. The optimum length of the level sensor spot array is 13.4mm.</p> |
