发明名称 Interposer frame assembly for mating a circuit board with an interposer assembly
摘要 An interposer frame assembly includes a static frame and a biasing frame. The static and biasing frames include legs joined with and oriented at an angle with respect to one another. The legs include mounting surfaces and opposite upper surfaces that are interconnected by an inner side. The mounting surfaces have outwardly protruding posts and the inner sides have protrusions extending away from the legs. The posts are received in openings of an interposer assembly such that the static frame and the biasing frame are aligned on opposite sides of a contact field of the interposer assembly. The protrusions of the static frame and the biasing members of the biasing frame guide and retain a circuit board with contacts into a mated relationship with corresponding contacts in the contact field of the interposer assembly.
申请公布号 US7871275(B1) 申请公布日期 2011.01.18
申请号 US20090631384 申请日期 2009.12.04
申请人 TYCO ELECTRONICS CORPORATION 发明人 MCCLELLAN JUSTIN SHANE;SWANGER NATHAN WILLIAM;REISINGER JUSTIN M'CHEYNE;MCCLINTON JEFFREY BYRON
分类号 H01R12/00 主分类号 H01R12/00
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