TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a tape for wafer processing capable of reducing occurrence of a label trace, achieving lighter weight, and installing a sensor for detecting a wafer sticking position from the upper side and lateral side of the upper surface of the tape for wafer processing in a wafer sticking machine.SOLUTION: A tape for wafer processing comprises: a long mold releasing film; an adhesive layer having a prescribed planar shape and provided on a first surface of the mold releasing film; an adhesive film covering the adhesive layer, having the prescribed planar shape, and provided so as to come into contact with the mold releasing film around the adhesive layer; and a support member provided at both ends in a short direction of the mold releasing film.SELECTED DRAWING: Figure 1