A low stress-inducing heat sink may reduce thermally induced stress and strain in the heat source. The low stress-inducing heat sink may be made of materials with low thermal conductivity. The heat sink may have in-plane flexibility and hence reduce thermally induced stress and strain generated in the heat source and at the interface of the heat sink and the heat source.
申请公布号
WO2010118183(A3)
申请公布日期
2011.01.13
申请号
WO2010US30307
申请日期
2010.04.07
申请人
SUNMODULAR, INC.;CARBONE, MARK;CORRALES, EUGENIA;MORELAND, ANTHONY