WAFER-PASTING ADHESIVE SHEET AND WAFER PROCESSING METHOD USING THE SAME

摘要

Provided is a wafer-pasting adhesive sheet, which comprises a base-material resin film, and an adhesive sheet that has an adhesive layer formed on the base-material resin film, wherein the wafer-pasting adhesive sheet has, when using a test strip that is obtained by processing the adhesive sheet so as to have a width of 5 mm, and using a dynamic-viscoelasticity measurement device, a minimum value of 0.20 or more for a loss-factor measured by applying a tensile stress with a frequency of 400-900 Hz, at a temperature of 23°C, and a minimum value of 0.20 or more for a loss-factor measured by applying a tensile stress with a frequency of 650 Hz, at a temperature of 15-40°C.