| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric compressor capable of improving cooling effect of a power semiconductor module and reducing the size and cost of the compressor.SOLUTION: A heat sink 18 is arranged on an end surface of a housing 11 for housing a compression mechanism 12 and an electric motor 13. An inverter 19 as the power semiconductor module for driving the electric motor 13 is installed in a manner capable of transmitting heat to the heat sink 18. The inside of the heat sink 18 is constituted so as to flow intake refrigerant. Heat generated by the inverter 19 is radiated from the heat sink 18 and the housing 11 via the heat sink 18. The intake refrigerant flowing inside the heat sink 18 deprives the heat sink 18 of heat to further increase a cooling effect of the inverter 19. |
