发明名称 SUBMINIATURE FUSE WITH SURFACE MOUNT END CAP AND IMPROVED CONNECTIVITY
摘要 PROBLEM TO BE SOLVED: To improve a subminiature fuse from the viewpoint of performance and manufacture.SOLUTION: This subminiature surface mount chip fuse includes a two part housing enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are built into the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.
申请公布号 JP2011009222(A) 申请公布日期 2011.01.13
申请号 JP20100146484 申请日期 2010.06.28
申请人 COOPER TECHNOLOGIES CO 发明人 WIRYANA SIDHARTA;RAHDAR ESSIE;ZHU TIANYU
分类号 H01H85/143;H01H85/17;H01H85/175;H01H85/18;H01H85/50 主分类号 H01H85/143
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