| 摘要 |
A multi layered substrate structure can be formed where the substrates are coupled together using surface Coulomb forces. Connect substrates electrically connects signals and DC voltages between the substrates. The connect substrates bypass output/input buffers between two communicating substrates. The capacitor substrates provide a fully charged capacitor that provides additional energy to a levitated substrate if the capacitor substrate is connected to the levitated substrate. VLSI systems can also be build on each of the substrates.
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