| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is constituted by suitably mounting a double-sided multi-electrode chip wherein a lot of electrodes are formed on both surfaces of a thin semiconductor chip.SOLUTION: The semiconductor device 100 is constituted by mounting the double-sided multi-electrode chip 11 wherein a plurality of electrodes D1 and D2 are formed on both the surfaces S1 and S2 of the semiconductor chip 21, respectively. The double-sided multi-electrode chip 11 is embedded in a multilayer wiring substrate 60 in such a manner that the double-sided multi-electrode chip is not exposed outside. The plurality of electrodes D1 and D2 of the double-sided multi-electrode chip 11 are connected to wiring layers H3 and H1 of the multilayer wiring substrate. |
