| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition exhibiting sufficiently excellent embedding property in a form of a film and usable for manufacturing a semiconductor device having excellent connection reliability; an adhesive sheet for connection of circuit members by using the composition; and a process for manufacture of the semiconductor device.SOLUTION: There is provided the adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, (E) organic microparticles, and (F) a powdery compound having a solid form at room temperature and a maximum particle diameter of ≤25 μm, wherein the component (F) comprises at least one compound selected from a compound having carboxyl group, a compound having methylol group and a hydrazide compound. |
