| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric wiring board which is reduced in peeling of a through-electrode, and to provide an optical module.SOLUTION: The electric wiring board includes a first dielectric layer, a second dielectric layer which has a dielectric constant different from that of the first dielectric layer and provided so as to contain the first dielectric layer therein, and the through-electrode which is provided penetrating the second dielectric layer between major surfaces thereof so as to come in contact with the first dielectric layer and second dielectric layer, and has a projection part entering into between the first dielectric layer and second dielectric layer. |
