| 摘要 |
A heat generating component (3) is mounted on a surface (4b) of a circuit board (4), said surface being on the case (13) side, and a recessed section (5) is formed at a position on the inner wall surface (12e) side of a bottom wall (12a) of a case (12), said position facing the heat generating component (3). A component clearance (Ca) in a desired size is provided between an inner wall surface (5a) of the recessed section (5) and the heat generating component (3), and a heat dissipating material (6) is disposed in the component clearance (Ca). On the circumferential end side of the recessed section (5), a circumferential end clearance (Cb) is provided between the surface (4b) of the circuit board (4), said surface being on the case (13) side, and an inner wall surface (12d) of the bottom wall (12a). |
