| 摘要 |
The present invention relates to a chip carrier (15) for contacting with a chip (16) and an antenna (13) disposed on an antenna substrate (17, 54, 61), wherein the chip carrier features a strip-shaped carrier substrate (18) which is provided with a chip contact arrangement (29) located at a distance from longitudinal ends (25, 26) of the carrier substrate for electrical contacting with a chip and which is provided with two antenna contact surfaces (27, 28) having the chip contact arrangement therebetween for electrical contacting with the antenna, wherein the chip contact arrangement and the antenna contact surfaces are located on an application surface (31) of the chip carrier and at least one insulation surface (20) is formed on the application surface (20) between the chip contact arrangement and the antenna contact surfaces. The invention also relates to a chip carrier arrangement comprising a plurality of chip carriers which are disposed on a film-like sheet carrier in at least one row extending in the longitudinal direction of the sheet carrier, wherein the individual chip carriers extend in the longitudinal direction of the sheet carrier.
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