发明名称 THREE-DIMENSIONAL SHAPE MEASURING DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional shape measuring device employing a light-section method inexpensive and suitable for use with a peripheral monitoring means in an on-vehicle environment.SOLUTION: This three-dimensional shape measuring device 1 for measuring a three-dimensional shape of a three-dimensional object 500 by the light-section method includes: a light source row 310; a camera 200 for imaging a monitoring domain; and an image recognition part 100 having an interface to the camera 200 and the light source row 310, and a CPU 110. The image recognition part 100 regards light applied from the light source row 310 as slit light applied with an irradiation pattern including a line segment connecting each light source center of light applied from each light source 320, and calculates a distance from the camera 200 on an irradiation position based on a difference between information of the irradiation position and the irradiation pattern of pseudo slit light 420 estimated based on luminance data of each pixel line from image data imaged relative to the monitoring domain irradiated with pseudo slit light 420, and measures a cut surface shape by the pseudo slit light 420 of the three-dimensional object 500.
申请公布号 JP2011007711(A) 申请公布日期 2011.01.13
申请号 JP20090153273 申请日期 2009.06.29
申请人 FUTURE UNIV-HAKODATE;RENESAS ELECTRONICS CORP 发明人 TODA SHINJI;NAGASAKI TAKESHI;WADA MASAAKI;HAYASHI KENICHIRO;KOTO YUICHI;OTSUKA SATOSHI
分类号 G01B11/24 主分类号 G01B11/24
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