发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component in which a sealing part can be securely sealed when lead members connected to a body extend to the outside of a housing through the sealing part, and to provide the electronic component.SOLUTION: In the method of manufacturing a multilayer electrolytic capacitor 1, the sealing part 6 of the housing 2 has a thermosetting resin material 15 to be thermally set injected between lead members 40, 50 and an inside resin layer of the housing 2. At this time, the thermosetting resin material 15 to be thermally set enters the gap between lead members 40, 50 and the housing 2, so even when the lead members 40, 50 connected to a laminate 3 extend to the outside of the housing 2 through the sealing part 6, the sealing part 6 can be securely sealed.
申请公布号 JP2011009516(A) 申请公布日期 2011.01.13
申请号 JP20090152268 申请日期 2009.06.26
申请人 TDK CORP 发明人 HASEGAWA HIROAKI
分类号 H01G9/10;H01G9/00;H01G9/08;H01G11/00;H01G11/22;H01G11/34;H01G11/60;H01M2/06;H01M2/30 主分类号 H01G9/10
代理机构 代理人
主权项
地址