发明名称 METHOD OF MANUFACTURING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate, capable of preventing dust generating from the end face of a substrate, and ensuring a wiring area enough for an inner layer circuit.SOLUTION: A workpiece containing glass fiber is subject to shearing, so as to obtain a substrate 8 from the workpiece. Then, a heated mold 12 is pressed to the sheared surface of the substrate 8 to apply heat at softening point or higher of glass fiber.
申请公布号 JP2011009525(A) 申请公布日期 2011.01.13
申请号 JP20090152346 申请日期 2009.06.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 OMICHI JURI;YOSHIOKA KENGO;HADATE TAKESHI
分类号 H05K3/00 主分类号 H05K3/00
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