Dissipating heat within housings for electrical components

摘要

Embodiments of various electrical housings, particularly display housings, are provided. In this regard, a representative housing, among others, includes one or more electrical components that are disposed at the housing; a thermal attachment that is designed to transfer heat generated by the one or more electrical components; and a rear enclosure that is designed to engage the thermal attachment. The rear enclosure is further designed to dissipate the heat received from the thermal attachment.

主权项

1. An electronic device comprising:
a housing; one or more electrical components that are disposed in the housing; a thermal attachment that is designed to transfer heat generated by the one or more electrical components, wherein the housing is configured to engage the thermal attachment so as to receive and dissipate heat received from the thermal attachment and wherein the housing and the thermal attachment are configured to cooperate so as to steer heat at a greater heat flow rate away from the electrical components towards corners of the housing as compared to a heat flow rate at which heat is steered to other portions of the housing.