| 摘要 |
PURPOSE: An adhesive composition is provided to obtain enough connection reliablility and adhesive property even in case that the width and space of electrodes of a connected circuit are very narrow and to suppress the degradation of adhesive property and connection reliablility even under high temperature and high humidity environment. CONSTITUTION: An adhesive composition comprises (A) a urethane resin containing a (math)acrylate group in a side chain and having the average molecular weight of 10,000-500,000; and (B) a hardener generating glass radical by optical irradiation or heating. The urethane resin(A) comprises a copolymer represented by the following chemical formula I. In the formula I, X shows a diisocyanate residue; Y shows the diol residue; and n shows an integer of 1-100. |
