发明名称 |
Structure and method for enhancing resistance to fracture of bonding pads |
摘要 |
The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced. |
申请公布号 |
US7867887(B2) |
申请公布日期 |
2011.01.11 |
申请号 |
US20080174074 |
申请日期 |
2008.07.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MELVILLE IAN D.;FAROOQ MUKTA G.;JUNG DAE YOUNG |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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